Base material: FR4, TG170
Surface treatment: ENIG
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control
Email Cynthia<sales11@hitechpcb.com\> if you are looking for remarkable HDI printed circuit board.