HDI PCB boards are thin, light and compact, and can achieve high-density interconnection of PCB boards.
HDI PCB stands for high-density interconnection PCB. HDI board is the name that Japanese companies have always given to high-density interconnection printed circuit boards, while in Europe and the United States, HDI boards are called "micro-perforated boards". HDI is a PCB technology. It is a method of making high-precision circuit boards that has developed with the development of electronic technology. It can achieve high-density wiring and is generally manufactured by stacking. HDI uses conventional multi-layer boards as the core board, and then stacks insulation and circuit layers (also known as "stacked layers") layer by layer, and uses laser drilling technology for layer drilling, so that the entire printed circuit board forms a layer connection with buried holes and blind holes as the main conduction method.
Compared with PCB, HDI PCB has higher production process requirements:
According to the actual difficulty, market size and development trend of basic HDI PCB manufacturing, HDI can be divided into the following three categories:
(1) Entry level: first order (1+C+1), second order (2+C+2), third order (3+C+3)
(2) General class: any layer (n+C+n, mostly 10-12 layers).
(3) High-end class: SLP, rigid flexible PCB board (rigid board area using HDI technology)
The advantages of HDI PCB are light, thin, short and small, which can increase circuit density, facilitate the use of advanced packaging technology, greatly improve signal output quality, greatly improve the function and performance of electronic and electrical products, and make electronic products more compact and convenient in appearance. For high-end communication products, HDI PCB technology helps to improve signal integrity, facilitate strict impedance control, and improve product performance.
According to Prismark's report, the output of HDI in 2018 was US$9.222 billion. Affected by the weak downstream mobile phone market, the output value in 2017 increased by only 2.8% year-on-year, while the total output value of the PCB market increased by 6.0% year-on-year. From 2018 to 2023, the annual growth rate of HDI output is expected to remain at around 2.9%.
If you have an inquiry for HDI PCB, please contact us, Cynthia<sales11@hitechpcb.com\>, thank you.